The G-ray latenium™ Monolithic Detector

will offer SIGNIFICANTLY higher spatial resolution with much reduced radiation doses.


Better spatial resolution and contrast ratio

Highest diagnostic quality and efficiency

Reduced radiation dose absorption

Reduced health risk

Energy discrimination

Enabling color x-ray

No special cooling

Lower maintenance cost

Higher speed

Real-time imaging for minimally invasive therapies

Light weight detector


The latenium™ detector first demonstrator will be ready by end of 2018


G-ray’s core product is a monolithic (= no bump-bonding) CMOS integrated pixel array detector, using a digital direct conversion mode.
This digital direct conversion mode :

(1) minimises image blurring
(2) allows energy discrimination
(3) permits high speed readout
(4) lowers dose procedures


  •  a combination of materials that define the sensitivity of the absorption layers,
  • smart electronics for signal processing, storage and post-processing,
  • a low temperature direct bonding technology without the need of any special high-temperature metallization layers.

Through the combination of the best available technologies, this new type of sensor has unique advantages in terms of spatial, energy and temporal resolution over all present bump-bonded detectors based on planar Si, CdTe or CdZnTe absorbers, as well as the monolithically integrated Si absorbers.

G-ray’s equipment permits space-filling arrays of tall germanium crystals to be synthesized, acting as pixel sensor.

G-ray’s monolithic X-ray photon imaging detector with one ASIC wafer, using Wafer-to-Wafer direct bonding without middle TSVs.

PCT Application number: IB2015/002385 | Inventor: Hans von Känel | Applicant: G-ray Switzerland SA
Title: Monolithic CMOS integrated pixel detector, and systems and methods for particle detection and imaging including various applications