The Commission for Technology and Innovation approved G-ray’s funding application. The Pixisens project supports the development of low temperature direct wafer bonding process providing material suitable for large-area high-resolution pixel detectors. It will contribute to confirm the disruptive characteristics of the G-ray detector – including significant reduction of radiation dose, energy discrimination, superior spatial resolution and dynamic imaging. Empa is the main research partner, whereas EV Group and CERN appear as suppliers.